Thermal paste application, 8 years of doing it wrong finally clicked
I've been building and repairing desktops since 2016. Always did the pea method, never thought twice. Last Tuesday I had a customer's old i7-4790K hitting 95C at idle. Reapplied paste three times with the pea method, no change. Out of frustration I spread it thin with a plastic card, like a perfect even layer. Dropped to 58C idle and 74C under load. Same paste, same cooler, same case. I honestly thought the pea method was foolproof based on every video I watched. But seeing that 37 degree drop in about 20 minutes changed my mind completely. Is there a scenario where the pea method is actually better, or was I just unlucky with this particular IHS and cooler combo?
Pea method only wins when the cooler mounts with high pressure and the IHS is dead flat. Sounds like your cold plate had a slight curve and the spread just filled the gaps better.